introduction to services
1.1 Wafer-Level Chip
1.1.1 introduction to WLCSP
What is CSP (Chip Scale Packaging)? Unfortunately
there is no globally recognized strict standard
definition at this moment. Currently it is generally
accepted if the ratio of package area to chip area
is less than 1.2:1; and the pitch (distance)
between two adjacent pins is less than 1.0 mm then
we can call it CSP. The rise of CSP can mostly be
attributed to the popularity and ever-shrinking
size of portable electronic gadgets.
In addition, the trend that major semiconductor
and consumer electronic companies
(such as Intel, NEC, Fujitsu, Sharp and Sony) are
adopting CSP technology on their latest generation
of products is helping to promote and encouraging
others to follow.
One product category that contributes the most
in driving the wide adoption of CSP is the mobile
phones. With CSP, the size of the package could
shrink to 1/4 to 1/10 over previous TSOP technology.
This reduction in size helps a lot in increasing
the capacity and functionality of new generation
mobile phones. Other suitable products are digital
camera, video, PDA, and any product that the smaller
size matters. Most Japanese manufacturers now consider
CSP as the preferred packaging technology.
What is WLCSP (Wafer-Level Chip Scale Packaging)?
WLCSP is a newer technology that breaks away from
previous mode of packaging.
It does not require wire bonding, molding, lead
framing, or sub trays. Instead, the manufacturing
(packaging) requires many processes previously only
used in the front end (foundry level) such as spin
coatering, developing, sputtering, steppering, plasma
etching; as well as traditional PCB processes such
as plating, stripping, UBM etching, ball placement
The major advantages of WLCSP is smaller size,
lower cost, shorter manufacturing cycle time, and
requires less packaging material and simpler tooling.
WSCSP is generally applicable to any IC that has
200 pins or less. Those IC's can be used in many
consumer electronic products: memory cards, portable
video players, mobile phones, digital cameras, portable
audio products, PDA's, notebook computers, etc.
1.1.2 The construction of WLCSP production line
Ace Semi and APiA has joint ventured a production
line that has the capacity of 20K WLCSP per month.
The installation of various equipments will start
around the end of this year. Those equipments will
include Spin coater, Develop, Sputter, Stepper,
RIE (Plasma etch), Plating, Stripper, UBM etch,
Ball Placement cluster etc; also include cutter,
grinder, chip selector, etc.
We forecast installation and testing of those equipments
will be completed by the end of the first quarter
1.1.3 Planning the capacity of WLCSP production
We project in the beginning of Q2/2007, the initial
monthly production capacity will be 20K W. We will
expand the monthly production capacity to 60K around
1.2 Wafer and final testing
1.2.1 Testing service:
one-stop shopping on all testing related services
which include product design, wafer test, wafer
package, final test, SMT; We also provide drop shipment
to customer designated destinations.
1.2.2 Capacity of testing services
We project that we will be able to start small
volume production by the end of 2007.
The production capacity will be 3,000,000 chips
per month for DRAM/SRAM products and 2,000,000 pieces
per month for flash products. Volume production
will begin in the first quarter of 2008. The first
stage production capacity will be 20,000 wafers
or 8,000,000 chips for DRAM/SRAM products; and 5,000,000
per month for flash products.
If using our specialty on WLCSP, we could reach
We project at the end of 2008, our monthly capacity
will reach 60,000 wafers, or 36,000,000 chips per
month. Yearly volume will be 720,000 wafers or 432,000,000